Picha inaweza kuwa uwakilishi.
Angalia vipimo kwa maelezo ya bidhaa.
IS42S16100F-6BLI

IS42S16100F-6BLI

Product Overview

Category

IS42S16100F-6BLI belongs to the category of dynamic random-access memory (DRAM) modules.

Use

This product is primarily used as a main memory component in various electronic devices such as computers, laptops, servers, and embedded systems.

Characteristics

  • High-speed operation: The IS42S16100F-6BLI offers fast data access and transfer rates, making it suitable for applications that require quick and efficient memory operations.
  • Large storage capacity: With a capacity of 16 megabits (2 megabytes), this DRAM module provides ample space for storing data and instructions.
  • Low power consumption: The module is designed to consume minimal power, ensuring energy efficiency in electronic devices.
  • Compact package: The IS42S16100F-6BLI comes in a small form factor package, allowing for easy integration into various circuit boards and systems.
  • RoHS compliant: This product adheres to the Restriction of Hazardous Substances directive, ensuring its environmental friendliness.

Packaging/Quantity

The IS42S16100F-6BLI is typically packaged in trays or reels, containing a specific quantity of modules per package. The exact packaging and quantity may vary depending on the manufacturer's specifications.

Specifications

  • Memory Type: Synchronous DRAM (SDRAM)
  • Organization: 1M words x 16 bits
  • Supply Voltage: 3.3V
  • Clock Frequency: 166 MHz
  • Access Time: 6 ns
  • Operating Temperature Range: -40°C to +85°C
  • Interface: Parallel
  • Package Type: 54-ball FBGA (Fine-Pitch Ball Grid Array)

Detailed Pin Configuration

The IS42S16100F-6BLI module has a total of 54 pins, each serving a specific function. The pin configuration is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. DQ8
  12. DQ9
  13. DQ10
  14. DQ11
  15. DQ12
  16. DQ13
  17. DQ14
  18. DQ15
  19. VSS
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. /CAS
  37. /RAS
  38. /WE
  39. /CS
  40. /CKE
  41. /BA0
  42. /BA1
  43. /A16
  44. /A17
  45. /A18
  46. VCC
  47. VCC
  48. VCC
  49. VCC
  50. VCC
  51. VCC
  52. VCC
  53. VCC
  54. VCC

Functional Features

  • High-speed data access: The IS42S16100F-6BLI offers fast read and write operations, enabling efficient data transfer between the memory module and the processor.
  • Burst mode support: This module supports burst mode, allowing for consecutive data transfers without the need for individual address commands.
  • Auto-refresh capability: The IS42S16100F-6BLI automatically refreshes the stored data at regular intervals, ensuring data integrity and reliability.
  • Self-timed write cycle: The module incorporates a self-timed write cycle, simplifying the memory write process for the user.

Advantages and Disadvantages

Advantages

  • High-speed operation enables quick data access and transfer.
  • Large storage capacity provides ample space for storing data and instructions.
  • Low power consumption ensures energy efficiency in electronic devices.
  • Compact package allows for easy integration into various circuit boards and systems.
  • RoHS compliance ensures environmental friendliness.

Disadvantages

  • Limited compatibility with certain older systems that do not support SDRAM technology.
  • Relatively higher cost compared to other memory technologies such as NAND flash.

Working Principles

The IS42S16100F-6BLI operates based on the principles of synchronous dynamic random-access memory (SDRAM). It utilizes a clock signal to synchronize data transfers between the memory module and the processor. When a read or write command is issued, the module accesses the requested data from its internal memory cells and transfers it to/from the processor via the data bus.

Detailed

Orodhesha maswali na majibu 10 ya kawaida yanayohusiana na utumiaji wa IS42S16100F-6BLI katika suluhu za kiufundi

Sure! Here are 10 common questions and answers related to the application of IS42S16100F-6BLI in technical solutions:

  1. Question: What is IS42S16100F-6BLI?
    - Answer: IS42S16100F-6BLI is a specific type of synchronous dynamic random-access memory (SDRAM) chip commonly used in various technical solutions.

  2. Question: What is the capacity of IS42S16100F-6BLI?
    - Answer: The IS42S16100F-6BLI has a capacity of 16 megabits (Mb), which is equivalent to 2 megabytes (MB).

  3. Question: What is the operating voltage range for IS42S16100F-6BLI?
    - Answer: The operating voltage range for IS42S16100F-6BLI is typically between 2.5V and 3.3V.

  4. Question: What is the maximum clock frequency supported by IS42S16100F-6BLI?
    - Answer: IS42S16100F-6BLI supports a maximum clock frequency of 166 MHz.

  5. Question: What is the data transfer rate of IS42S16100F-6BLI?
    - Answer: The data transfer rate of IS42S16100F-6BLI is 166 million transfers per second (MT/s).

  6. Question: Can IS42S16100F-6BLI be used in mobile devices?
    - Answer: Yes, IS42S16100F-6BLI can be used in mobile devices that require SDRAM for memory storage and processing.

  7. Question: Is IS42S16100F-6BLI compatible with different microcontrollers?
    - Answer: Yes, IS42S16100F-6BLI is compatible with various microcontrollers that support SDRAM interfaces.

  8. Question: What are some typical applications of IS42S16100F-6BLI?
    - Answer: IS42S16100F-6BLI is commonly used in applications such as embedded systems, networking equipment, telecommunications devices, and industrial automation.

  9. Question: Does IS42S16100F-6BLI support burst mode operation?
    - Answer: Yes, IS42S16100F-6BLI supports burst mode operation for efficient data transfer.

  10. Question: Can IS42S16100F-6BLI be used in low-power applications?
    - Answer: Yes, IS42S16100F-6BLI has low-power features and can be used in low-power applications where energy efficiency is important.

Please note that the answers provided here are general and may vary depending on specific technical requirements and implementation scenarios.