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IS43DR82560C-3DBL

IS43DR82560C-3DBL

Product Overview

Category

IS43DR82560C-3DBL belongs to the category of dynamic random-access memory (DRAM) products.

Use

This product is primarily used for high-performance computing applications, such as servers, workstations, and networking equipment.

Characteristics

  • High-speed operation
  • Large storage capacity
  • Low power consumption
  • Reliable performance

Package

IS43DR82560C-3DBL is available in a compact and industry-standard package, suitable for surface mount technology (SMT) assembly.

Essence

The essence of IS43DR82560C-3DBL lies in its ability to provide fast and efficient data storage and retrieval capabilities for demanding computing tasks.

Packaging/Quantity

This product is typically packaged in reels or trays, with quantities varying based on customer requirements.

Specifications

  • Memory Size: 256 Megabits (32 Megabytes)
  • Organization: 8 Meg x 32
  • Supply Voltage: 1.8V ±0.1V
  • Operating Temperature Range: -40°C to +85°C
  • Clock Frequency: Up to 400 MHz
  • Interface: Double Data Rate 3 (DDR3)
  • Burst Length: 4 or 8
  • Refresh Options: Auto-refresh and Self-refresh

Detailed Pin Configuration

The pin configuration of IS43DR82560C-3DBL is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. DQ8
  11. DQ9
  12. DQ10
  13. DQ11
  14. DQ12
  15. DQ13
  16. DQ14
  17. DQ15
  18. VSS
  19. /WE
  20. /CAS
  21. /RAS
  22. /CS
  23. /CKE
  24. A0
  25. A1
  26. A2
  27. A3
  28. A4
  29. A5
  30. A6
  31. A7
  32. A8
  33. A9
  34. A10
  35. A11
  36. A12
  37. A13
  38. A14
  39. A15
  40. VDDQ

Functional Features

  • High-speed data transfer with DDR3 interface
  • Efficient burst mode operation for improved performance
  • Auto-refresh and self-refresh options for power-saving capabilities
  • On-die termination (ODT) for signal integrity optimization
  • Internal calibration for reliable operation in various environments

Advantages and Disadvantages

Advantages

  • Fast and efficient data access
  • Large storage capacity
  • Low power consumption
  • Reliable performance in demanding applications

Disadvantages

  • Higher cost compared to other memory technologies
  • Limited compatibility with older systems

Working Principles

IS43DR82560C-3DBL operates based on the principles of dynamic random-access memory. It stores data in capacitors within each memory cell, which must be periodically refreshed to maintain the stored information. The DDR3 interface allows for high-speed data transfer between the memory and the processor.

Detailed Application Field Plans

IS43DR82560C-3DBL is well-suited for a wide range of applications, including: - Servers - Workstations - Networking equipment - High-performance computing clusters - Data centers

Detailed and Complete Alternative Models

Some alternative models that offer similar functionality to IS43DR82560C-3DBL include: - IS43TR82560C-3DBL - IS43DR82560D-3DBL - IS43DR82560E-3DBL

These models provide comparable specifications and can be considered as alternatives based on specific application requirements.

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Orodhesha maswali na majibu 10 ya kawaida yanayohusiana na utumiaji wa IS43DR82560C-3DBL katika suluhu za kiufundi

Sure! Here are 10 common questions and answers related to the application of IS43DR82560C-3DBL in technical solutions:

  1. Q: What is IS43DR82560C-3DBL? A: IS43DR82560C-3DBL is a specific model of DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip.

  2. Q: What is the capacity of IS43DR82560C-3DBL? A: The IS43DR82560C-3DBL has a capacity of 256 Megabits (Mb), which is equivalent to 32 Megabytes (MB).

  3. Q: What is the operating voltage range for IS43DR82560C-3DBL? A: The operating voltage range for IS43DR82560C-3DBL is typically between 1.425V and 1.575V.

  4. Q: What is the clock frequency supported by IS43DR82560C-3DBL? A: IS43DR82560C-3DBL supports a clock frequency of up to 800 MHz.

  5. Q: What is the data transfer rate of IS43DR82560C-3DBL? A: The data transfer rate of IS43DR82560C-3DBL is 1600 Megabits per second (Mbps).

  6. Q: Can IS43DR82560C-3DBL be used in mobile devices? A: Yes, IS43DR82560C-3DBL can be used in mobile devices such as smartphones and tablets.

  7. Q: Does IS43DR82560C-3DBL support low-power modes? A: Yes, IS43DR82560C-3DBL supports low-power modes like power-down and self-refresh to conserve energy.

  8. Q: What is the package type of IS43DR82560C-3DBL? A: IS43DR82560C-3DBL comes in a 96-ball BGA (Ball Grid Array) package.

  9. Q: Can IS43DR82560C-3DBL be used in industrial applications? A: Yes, IS43DR82560C-3DBL is suitable for various industrial applications that require reliable memory solutions.

  10. Q: Are there any specific design considerations when using IS43DR82560C-3DBL? A: Yes, it is important to follow the recommended layout guidelines and timing specifications provided in the datasheet for optimal performance.

Please note that these answers are general and may vary depending on the specific requirements and use cases. It is always recommended to refer to the official documentation and consult with technical experts for accurate information.