Memory chip

Nambari ya Sehemu
MICROCHIP (US Microchip)
Watengenezaji
Maelezo
50544 PCS
Katika Hisa
Nambari ya Sehemu
MICROCHIP (US Microchip)
Watengenezaji
Maelezo
79350 PCS
Katika Hisa
Nambari ya Sehemu
GigaDevice (GigaDevice Innovation)
Watengenezaji
Maelezo
95778 PCS
Katika Hisa
Nambari ya Sehemu
ISSI (American core into)
Watengenezaji
Maelezo
53696 PCS
Katika Hisa
Nambari ya Sehemu
MICROCHIP (US Microchip)
Watengenezaji
Maelezo
88712 PCS
Katika Hisa
Nambari ya Sehemu
CYPRESS (Cypress)
Watengenezaji
Maelezo
65059 PCS
Katika Hisa
Nambari ya Sehemu
ST (STMicroelectronics)
Watengenezaji
Maelezo
87672 PCS
Katika Hisa
Nambari ya Sehemu
ICMAX (Hong Wang)
Watengenezaji
Maelezo
62437 PCS
Katika Hisa
Nambari ya Sehemu
FMD (Hui Mang Micro)
Watengenezaji
Maelezo
79506 PCS
Katika Hisa
Nambari ya Sehemu
WINBOND (Winbond)
Watengenezaji
Maelezo
83325 PCS
Katika Hisa
Nambari ya Sehemu
MICROCHIP (US Microchip)
Watengenezaji
Maelezo
95844 PCS
Katika Hisa
Nambari ya Sehemu
CYPRESS (Cypress)
Watengenezaji
Maelezo
53863 PCS
Katika Hisa
Nambari ya Sehemu
micron
Watengenezaji
1-Gbit(128M x 8bit), parallel interface, working voltage: 2.7V to 3.6V
Maelezo
87415 PCS
Katika Hisa
Nambari ya Sehemu
MICROCHIP (US Microchip)
Watengenezaji
Maelezo
82927 PCS
Katika Hisa
Nambari ya Sehemu
HGSEMI (Huaguan)
Watengenezaji
2.7-5.0V
Maelezo
82037 PCS
Katika Hisa
Nambari ya Sehemu
ST (STMicroelectronics)
Watengenezaji
Maelezo
97078 PCS
Katika Hisa
Nambari ya Sehemu
MICROCHIP (US Microchip)
Watengenezaji
Maelezo
54788 PCS
Katika Hisa
Nambari ya Sehemu
MICROCHIP (US Microchip)
Watengenezaji
Maelezo
69188 PCS
Katika Hisa
Nambari ya Sehemu
CYPRESS (Cypress)
Watengenezaji
Maelezo
83439 PCS
Katika Hisa
Nambari ya Sehemu
CS (Creation)
Watengenezaji
SD NAND second generation, driver-free, standard SDIO interface, compatible with SPI/SD/eMMC interface, compatible with major MCU platforms; built-in EDC/ECC, bad block management, garbage collection algorithm; can be machine-mounted, lock wafer and controller , High consistency; built-in SLC wafer, 10W erasing and writing life, passed 10,000 random power-off tests, and supports industrial-grade temperature -40°~+85°. CS (Creation) SD NAND is also called by many developers and friends: SMD TF card, SMD SD card, SMD card, soldered SD card, soldered TF card, industrial-grade TF card, industrial-grade SD card, embedded SD card, etc. It mainly solves the problem that the main control (such as STM32 series MCU MCU) needs to manage NAND FLASH by itself when using SLC NAND FLASH, SPI NAND FLASH, eMMC, etc. CS (Genesis) SD NAND can be used without drivers (so it is also called no need to write drivers NAND Flash). Compared with eMMC, CS (Genesis) SD NAND has fewer pins (convenient for soldering); smaller capacity (can help customers reduce costs); longer erasing life; smaller size (occupies only 1/3 of eMMC PCB area) ); save the number of PCB board layers (2-layer board can be used)
Maelezo
66033 PCS
Katika Hisa